Wafer Fabrication Manufacturing Engineer, Raxium, Night Shift
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Minimum qualifications:
- Bachelor's degree in an Engineering field, or equivalent practical experience.
- 10 years of experience working in a production semiconductor wafer fab cleanroom environment.
- Experience applying Lean Manufacturing principles in production environments.
- Experience with microelectronics fabrication.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
About the job
This position is onsite. The shift includes Sunday, Monday, Tuesday and every other Saturday 7pm to 7am or Wednesday, Thursday, Friday and every other Saturday 7pm to 7am.
Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.
The US base salary range for this full-time position is $126,000-$181,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Responsibilities
- Monitor and sustain, and support fabrication processes encompassing areas of lithography, thin film, etch, clean, thermal, metrology/characterization and backside wafer thinning.
- Ensure process robustness, efficiency and consistency by providing technical support to technicians.
- Work with process engineers, metrology engineers and integration engineers to review, propose, optimize, improve and implement various wafer fabrication processes and new equipment introduction for safety enhancement, yield improvement, defectivity reduction, and manufacturability.
- Enhance area process control plan and the process capability through implementation of best known manufacturing methods, lean manufacturing principle and the statistical process control (SPC).
- Document process specifications, procedures, out of control action plan (OCAP) and train technicians.
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